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avx multilayer ceramic chip capacitor
mlc chip capacitors general description 1 - 6 how to order - avx part number explanation 7 c0g (np0) dielectric general specifications 8 typical characteristic curves 9 capacitance range 10 - 11 x7r dielectric general specifications 12 typical characteristic curves 13 capacitance range 14 - 15 z5u dielectric general specifications 16 typical characteristic curves 17 capacitance range 18 - 19 y5v dielectric general specifications 20 typical characteristic curves 21 capacitance range 22 low profile chips for z5u & y5v dielectric 23 high voltage chips for 500v to 5000v applications 24 - 25 general specifications mechanical 26 environmental 27 - 28 mil-c-55681/chips part number example 29 military part number identification (cdr01 thru cdr06) 30 military part number identification (cdr31 thru cdr35) 31 military part number identification (cdr31) 32 military part number identification (cdr32) 33 military part number identification (cdr33/34/35) 34 european version cecc 32 101-801 chips 35 packaging of chip components automatic insertion packaging 36 embossed carrier configuration - 8 & 12mm tape 8 & 12mm tape 37 punched carrier configuration - 8 & 12mm tape 8 & 12mm tape 38 bulk case packaging 39 surface mounting guide 40 - 43 ceramic chip capacitors table of contents
1 general description formulations ? multilayer ceramic capacitors are available in both class 1 and class 2 formulations. temperature compensating formulation are class 1 and temperature sta- ble and general application formulations are classified as class 2. class 1 ? class 1 capacitors or temperature compensating capacitors are usually made from mixtures of titanates where barium titanate is normally not a major part of the mix. they have predictable temperature coefficients and in general, do not have an aging characteristic. thus they are the most stable capacitor available. normally the t.c.s of multilayer ceramic capacitors are np0 class 1 temperature compensating capacitors (negative-positive 0 ppm/?). class 2 class 2 capacitors are ?erro electric?and vary in capacitance value under the influence of the environmental and electrical operating conditions. class 2 capacitors are affected by temperature, voltage (both ac and dc), fre- quency and time. temperature effects for class 2 ceramic capacitors are exhibited as non-linear capacitance changes with temperature. the most common temperature stable formulation for mlcs is x7r while z5u and y5v are the most common general application formulations. for additional information on performance changes with operating conditions consult avx? software, spicap. basic construction ? a multilayer ceramic (mlc) capaci- tor is a monolithic block of ceramic containing two sets of offset, interleaved planar electrodes that extend to two opposite surfaces of the ceramic dielectric. this simple structure requires a considerable amount of sophistication, both in material and manufacture, to produce it in the quality and quantities needed in today? electronic equipment. ceramic layer electrode terminated edge terminated edge end terminations margin electrodes
2 general description effects of voltage ? variations in voltage have little affect on class 1 dielectric but does effect the capacitance and dissipation factor of class 2 dielectrics. the application of dc voltage reduces both the capacitance and dissipation factor while the application of an ac voltage within a rea- sonable range tends to increase both capacitance and dis- sipation factor readings. if a high enough ac voltage is applied, eventually it will reduce capacitance just as a dc voltage will. figure 2 shows the effects of ac voltage. capacitor specifications specify the ac voltage at which to measure (normally 0.5 or 1 vac) and application of the wrong voltage can cause spurious readings. figure 3 gives the voltage coefficient of dissipation factor for various ac voltages at 1 kilohertz. applications of different frequencies will affect the percentage changes versus voltages. the effect of the application of dc voltage is shown in figure 4. the voltage coefficient is more pronounced for higher k dielectrics. these figures are shown for room tem- perature conditions. the combination characteristic known as voltage temperature limits which shows the effects of rated voltage over the operating temperature range is shown in figure 5 for the military bx characteristic. cap. change vs. d.c. volts avx x7r t.c. typical cap. change vs. temperature avx x7r t.c. effects of time ? class 2 ceramic capacitors change capacitance and dissipation factor with time as well as tem- perature, voltage and frequency. this change with time is known as aging. aging is caused by a gradual re-alignment of the crystalline structure of the ceramic and produces an exponential loss in capacitance and decrease in dissipation factor versus time. a typical curve of aging rate for semi- stable ceramics is shown in figure 6. if a class 2 ceramic capacitor that has been sitting on the shelf for a period of time, is heated above its curie point, (125? for 4 hours or 150? for 1 2 hour will suffice) the part will de-age and return to its initial capacitance and dissipa- tion factor readings. because the capacitance changes rapidly, immediately after de-aging, the basic capacitance measurements are normally referred to a time period some- time after the de-aging process. various manufacturers use different time bases but the most popular one is one day or twenty-four hours after ?ast heat.?change in the aging curve can be caused by the application of voltage and other stresses. the possible changes in capacitance due to de- aging by heating the unit explain why capacitance changes are allowed after test, such as temperature cycling, mois- ture resistance, etc., in mil specs. the application of high voltages such as dielectric withstanding voltages also tends 25% 50% 75% 100% percent rated volts capacitance change percent 2.5 0 -2.5 -5 -7.5 -10 ovdc rvdc -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 temperature degrees centigrade capacitance change percent +20 +10 0 -10 -20 -30 figure 2 50 40 30 20 10 0 12.5 25 37.5 50 volts ac at 1.0 khz capacitance change percent cap. change vs. a.c. volts avx x7r t.c. figure 3 curve 3 - 25 vdc rated capacitor curve 2 - 50 vdc rated capacitor curve 1 - 100 vdc rated capacitor curve 3 curve 2 curve 1 .5 1.0 1.5 2.0 2.5 ac measurement volts at 1.0 khz dissipation factor percent 10.0 8.0 6.0 4.0 2.0 0 d.f. vs. a.c. measurement volts avx x7r t.c. figure 4 figure 5
3 to de-age capacitors and is why re-reading of capacitance after 12 or 24 hours is allowed in military specifications after dielectric strength tests have been performed. effects of frequency ? frequency affects capacitance and impedance characteristics of capacitors. this effect is much more pronounced in high dielectric constant ceramic formulation that is low k formulations. avx? spicap soft- ware generates impedance, esr, series inductance, series resonant frequency and capacitance all as functions of fre- quency, temperature and dc bias for standard chip sizes and styles. it is available free from avx. effects of mechanical stress ? high ??dielectric ceramic capacitors exhibit some low level piezoelectric reactions under mechanical stress. as a general statement, the piezoelectric output is higher, the higher the dielectric constant of the ceramic. it is desirable to investigate this effect before using high ??dielectrics as coupling capaci- tors in extremely low level applications. reliability ? historically ceramic capacitors have been one of the most reliable types of capacitors in use today. the approximate formula for the reliability of a ceramic capacitor is: l o = v t x t t y l t v o t o where l o = operating life t t = test temperature and l t = test life t o = operating temperature v t = test voltage in ? v o = operating voltage x,y = see text historically for ceramic capacitors exponent x has been considered as 3. the exponent y for temperature effects typically tends to run about 8. a capacitor is a component which is capable of storing electrical energy. it consists of two conductive plates (elec- trodes) separated by insulating material which is called the dielectric. a typical formula for determining capacitance is: c = .224 ka t c = capacitance (picofarads) k = dielectric constant (vacuum = 1) a = area in square inches t = separation between the plates in inches (thickness of dielectric) .224 = conversion constant (.0884 for metric system in cm) capacitance ? the standard unit of capacitance is the farad. a capacitor has a capacitance of 1 farad when 1 coulomb charges it to 1 volt. one farad is a very large unit and most capacitors have values in the micro (10 -6 ), nano (10 -9 ) or pico (10 -12 ) farad level. dielectric constant in the formula for capacitance given above the dielectric constant of a vacuum is arbitrarily cho- sen as the number 1. dielectric constants of other materials are then compared to the dielectric constant of a vacuum. dielectric thickness ? capacitance is indirectly propor- tional to the separation between electrodes. lower voltage requirements mean thinner dielectrics and greater capaci- tance per volume. area ? capacitance is directly proportional to the area of the electrodes. since the other variables in the equation are usually set by the performance desired, area is the easiest parameter to modify to obtain a specific capacitance within a material group. 1 10 100 1000 10,000 100,000 hours capacitance change percent +1.5 0 -1.5 -3.0 -4.5 -6.0 -7.5 characteristic max. aging rate %/decade np0 x7r z5u y5v none 1.5 5 5 figure 6 typical curve of aging rate x7r dielectric s s s s general description
4 general description energy stored ? the energy which can be stored in a capacitor is given by the formula: e = 1 2 cv 2 e = energy in joules (watts-sec) v = applied voltage c = capacitance in farads potential change ? a capacitor is a reactive component which reacts against a change in potential across it. this is shown by the equation for the linear charge of a capacitor: i i deal = c dv dt where i = current c = capacitance dv/dt = slope of voltage transition across capacitor thus an infinite current would be required to instantly change the potential across a capacitor. the amount of current a capacitor can ?ink?is determined by the above equation. equivalent circuit a capacitor, as a practical device, exhibits not only capacitance but also resistance and induc- tance. a simplified schematic for the equivalent circuit is: c = capacitance l = inductance r s = series resistance r p = parallel resistance reactance ? since the insulation resistance (r p ) is normally very high, the total impedance of a capacitor is: z = r 2 s + (x c - x l ) 2 where z = total impedance r s = series resistance x c = capacitive reactance = 1 2 fc x l = inductive reactance = 2 fl the variation of a capacitor? impedance with frequency determines its effectiveness in many applications. phase angle ? power factor and dissipation factor are often confused since they are both measures of the loss in a capacitor under ac application and are often almost identi- cal in value. in a ?erfect?capacitor the current in the capacitor will lead the voltage by 90? in practice the current leads the voltage by some other phase angle due to the series resistance r s . the comple- ment of this angle is called the loss angle and: power factor (p.f.) = cos f or sine d dissipation factor (d.f.) = tan d for small values of d the tan and sine are essentially equal which has led to the common interchangeability of the two terms in the industry. equivalent series resistance ? the term e.s.r. or equivalent series resistance combines all losses both series and parallel in a capacitor at a given frequency so that the equivalent circuit is reduced to a simple r-c series connection. dissipation factor ? the df/pf of a capacitor tells what percent of the apparent power input will turn to heat in the capacitor. dissipation factor = e.s.r. = (2 fc) (e.s.r.) x c the watts loss are: watts loss = (2 fcv 2 ) (d.f.) very low values of dissipation factor are expressed as their reciprocal for convenience. these are called the ??or quality factor of capacitors. parasitic inductance the parasitic inductance of capac- itors is becoming more and more important in the decou- pling of today? high speed digital systems. the relationship between the inductance and the ripple voltage induced on the dc voltage line can be seen from the simple inductance equation: v = l di dt r l r c p s ? d i (ideal) i (actual) phase angle loss a ngle v ir s f e.s.r. c
5 the seen in current microprocessors can be as high as 0.3 a/ns, and up to 10a/ns. at 0.3 a/ns, 100ph of parasitic inductance can cause a voltage spike of 30mv. while this does not sound very drastic, with the vcc for microproces- sors decreasing at the current rate, this can be a fairly large percentage. another important, often overlooked, reason for knowing the parasitic inductance is the calculation of the resonant frequency. this can be important for high frequency, by- pass capacitors, as the resonant point will give the most signal attenuation. the resonant frequency is calculated from the simple equation: f res = 1 2 p lc insulation resistance ? insulation resistance is the resis- tance measured across the terminals of a capacitor and consists principally of the parallel resistance r p shown in the equivalent circuit. as capacitance values and hence the area of dielectric increases, the i.r. decreases and hence the product (c x ir or rc) is often specified in ohm farads or more commonly megohm-microfarads. leakage current is determined by dividing the rated voltage by ir (ohm? law). dielectric strength ? dielectric strength is an expression of the ability of a material to withstand an electrical stress. although dielectric strength is ordinarily expressed in volts, it is actually dependent on the thickness of the dielectric and thus is also more generically a function of volts/mil. dielectric absorption ? a capacitor does not discharge instantaneously upon application of a short circuit, but drains gradually after the capacitance proper has been dis- charged. it is common practice to measure the dielectric absorption by determining the ?eappearing voltage?which appears across a capacitor at some point in time after it has been fully discharged under short circuit conditions. corona ? corona is the ionization of air or other vapors which causes them to conduct current. it is especially prevalent in high voltage units but can occur with low volt ages as well where high voltage gradients occur. the energy discharged degrades the performance of the capacitor and can in time cause catastrophic failures. di dt general description ?
6 i. capacitance (farads) english: c = .224 k a t d metric: c = .0884 k a t d ii. energy stored in capacitors (joules, watt - sec) e = 1 2 cv 2 iii. linear charge of a capacitor (amperes) i = c dv dt iv. total impedance of a capacitor (ohms) z = r 2 s + (x c - x l ) 2 v. capacitive reactance (ohms) x c = 1 2 fc vi. inductive reactance (ohms) x l = 2 fl vii. phase angles: ideal capacitors: current leads voltage 90 ideal inductors: current lags voltage 90 ideal resistors: current in phase with voltage viii. dissipation factor (%) d.f.= tan d (loss angle) = e.s.r. = (2 fc) (e.s.r.) x c ix. power factor (%) p.f. = sine d (loss angle) = cos f (phase angle) p.f. = (when less than 10%) = df x. quality factor (dimensionless) q = cotan d (loss angle) = 1 d.f. xi. equivalent series resistance (ohms) e.s.r. = (d.f.) (xc) = (d.f.) / (2 fc) xii. power loss (watts) power loss = (2 fcv 2 ) (d.f.) xiii. kva (kilowatts) kva = 2 fcv 2 x 10 -3 xiv. temperature characteristic (ppm/?) t.c. = ct ?c 25 x 10 6 c 25 (t t ?25) xv. cap drift (%) c.d. = c 1 ?c 2 x 100 c 1 xvi. reliability of ceramic capacitors l 0 = v t xt t y l t ( v o )( t o ) xvii. capacitors in series (current the same) any number: 1 = 1 + 1 --- 1 c t c 1 c 2 c n c 1 c 2 two: c t = c 1 + c 2 xviii. capacitors in parallel (voltage the same) c t = c 1 + c 2 --- + c n xix. aging rate a.r. = % d c/decade of time xx. decibels db = 20 log v 1 v 2 ? pico x 10 -12 nano x 10 -9 micro x 10 -6 milli x 10 -3 deci x 10 -1 deca x 10 +1 kilo x 10 +3 mega x 10 +6 giga x 10 +9 tera x 10 +12 k = dielectric constant f = frequency l t = test life a = area l = inductance v t = test voltage t d = dielectric thickness d = loss angle v o = operating voltage v = voltage f = phase angle t t = test temperature t = time x & y = exponent effect of voltage and temp. t o = operating temperature r s = series resistance l o = operating life metric prefixes symbols basic capacitor formulas general description
7 how to order part number explanation example: 08055a101jat2a 0805 size (l" x w") 0402 0504 0603 0805 1005 0907 1206 1210 1505 1805 1808 1812 1825 2225 3640 5 voltage 10v = z 16v = y 25v = 3 50v = 5 100v = 1 200v = 2 250v = v 500v = 7 600v = c 1000v = a 1500v = s 2000v = g 2500v = w 3000v = h 4000v = j 5000v = k a dielectric c0g (np0) = a x7r = c x5r = d z5u = e y5v = g 101 capacitance code (2 significant digits + no. of zeros) examples: j capacitance tolerance a failure rate a = not applicable t terminations 2a special code 10 pf = 100 100 pf = 101 1,000 pf = 102 22,000 pf = 223 220,000 pf = 224 1 ? = 105 c = ?25 pf* d = ?50 pf* f=1% ( 3 25 pf) g=2% ( 3 13 pf) j=5% k = ?0% m = ?0% z = +80%, -20% p = +100%, -0% others: 6 = waffle 7 = bulk cassette 9 = bulk * c&d tolerances for # 10 pf values. ** see pages 36-39. note: unmarked product is standard. marked product is available on special request, please contact avx. standard: t = ni and tin plated a = standard product low profile chips only max. thickness t = .66mm (.026") s = .56mm (.022") r = .46mm (.018") p = .38mm (.015") d = non standard dimension packaging** for values below 10 pf, use ??in place of decimal point, e.g., 9.1 pfd = 9r1. recommended: 1 =7" reel embossed tape 2 =7" reel paper tape 3 =13" reel embossed tape 4 =13" reel paper tape others: 7 = plated ni gold plated 1 = pd/ag
8 c0g (np0) dielectric general specifications c0g (np0) is the most popular formulation of the ?emper- ature-compensating,?eia class i ceramic materials. modern np0 formulations contain neodymium, samarium and other rare earth oxides. np0 ceramics offer one of the most stable capacitor dielectrics available. capacitance change with temperature is 0 ?0ppm/? which is less than ?.3% ? c from -55? to +125?. capacitance drift or hysteresis for np0 ceramics is negligible at less than ?.05% versus up to ?% for films. typical capacitance change with life is less than ?.1% for np0s, one-fifth that shown by most other dielectrics. np0 formulations show no aging characteristics. the np0 formulation usually has a ??in excess of 1000 and shows little capacitance or ??changes with frequency. their dielectric absorption is typically less than 0.6% which is similar to mica and most films. capacitance range 0.5 pf to .068 ? (1.0 ?.2 vrms, 1khz, for 100 pf use 1 mhz) capacitance tolerances preferred ?%, ?0% others available: ?25 pf, ?5 pf, ?% ( 3 25pf), ?%( 3 13pf), ?0% for values 10 pf preferred tolerance is ?5 pf, also available ?25 pf. operating temperature range -55? to +125? temperature characteristic 0 30 ppm/? (eia c0g) voltage ratings 25, 50, 100 & 200 vdc (+125?) dissipation factor and ? for values >30 pf: 0.1% max. (+25? and +125?) for values 30 pf: ??= 400 + 20 x c (c in pf) insulation resistance (+25?, rvdc) 100,000 megohms min. or 1000 m - ? min., whichever is less insulation resistance (+125?, rvdc) 10,000 megohms min. or 100 m - ? min., whichever is less dielectric strength 250% of rated voltage for 5 seconds at 50 mamp max. current test voltage 1 0.2 vrms test frequency for values 100 pf: 1 mhz for values >100 pf: 1 khz performance characteristics 0805 size (l" x w") 5 voltage 25v = 3 50v = 5 100v = 1 200v = 2 a dielectric c0g (np0) = a 101 capacitance code j capacitance tolerance preferred k = ?0% j = 5% a failure rate a = not applicable t terminations t = plated ni and solder 2 packaging 2 = 7" reel paper/unmarked a special code a = std. product part number (see page 7 for complete information and options)
9 c0g (np0) dielectric typical characteristic curves ** impedance, v 1,000 10,000 100 1 10 100 1000 frequency, mhz variation of impedance with cap value impedance vs. frequency 0805 - np0 10 pf vs. 100 pf vs. 1000 pf 10 pf 100 pf 1000 pf 1.0 0.1 10.0 100,000 typical capacitance change envelope: 0 30 ppm/ c % d capacitance +0.5 0 -0.5 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 temperature c temperature coefficient insulation resistance (ohm-farads) 1,000 10,000 100 0 +20 +25 +40 +60 +80 temperature c insulation resistance vs temperature +100 impedance, v 10 100 1000 frequency, mhz variation of impedance with chip size impedance vs. frequency 1000 pf - np0 1.0 0.1 10 1206 0805 1812 1210 impedance, v 10 100 1000 frequency, mhz variation of impedance with ceramic formulation impedance vs. frequency 1000 pf - np0 vs x7r 0805 0.10 0.01 1.00 x7r npo 10.00 % d capacitance +1 +2 0 -1 -2 1khz 10 khz 100 khz 1 mhz 10 mhz frequency d capacitance vs. frequency * standard sizes **for additional information on performance changes with operating conditions consult avx? software spicap. summary of capacitance ranges vs. chip size style 25v 50v 100v 200v 0402* 0.5pf - 220pf 0.5pf - 120pf 0504 0.5pf - 330pf 0.5pf - 150pf 0.5pf - 68pf 0603* 0.5pf - 1nf 0.5pf - 1nf 0.5pf - 330pf 0805* 0.5pf - 4.7nf 0.5pf - 2.2nf 0.5pf - 1nf 0.5pf - 470pf 1206* 0.5pf - 10nf 0.5pf - 4.7nf 0.5pf - 2.2nf 0.5pf - 1nf 1210* 560pf - 10nf 560pf - 10nf 560pf - 3.9nf 560pf - 1.5nf 1505 10pf - 1.5nf 10pf - 820pf 10pf - 560pf 1808 ? 1nf - 4.7nf 1nf - 3.9nf 1nf - 2.2nf 1812* 1nf - 15nf 1nf - 10nf 1nf - 4.7nf 1nf - 3.3nf 1825* ? 1nf - 22nf 1nf - 12nf 1nf - 6.8nf 2220 ? 4.7nf - 47nf 4.7nf - 39nf 3.3nf - 27nf 2225 ? 1nf - 68nf 1nf - 39nf 1nf - 39nf
10 c0g (np0) dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for higher voltage chips, see pages 24 and 25. preferred sizes are shaded size 0402* 0504* 0603* 0805 1206 1505 (l) length mm 1.00 .10 1.27 .25 1.60 .15 2.01 .20 3.20 .20 3.81 .25 (in.) (.040 .004) (.050 .010) (.063 .006) (.079 .008) (.126 .008) (.150 .010) (w) width mm .50 .10 1.02 .25 .81 .15 1.25 .20 1.60 .20 1.27 .25 (in.) (.020 .004) (.040 .010) (.032 .006) (.049 .008) (.063 .008) (.050 .010) (t) max. thickness mm .60 1.02 .90 1.30 1.50 1.27 (in.) (.024) (.040) (.035) (.051) (.059) (.050) (t) terminal mm .25 .15 .38 .13 .35 .15 .50 .25 .50 .25 .50 .25 (in.) (.010 .006) (.015 .005) (.014 .006) (.020 .010) (.020 .010) (.020 .010) wvdc 25 50 25 50 100 25 50 100 25 50 100 200 25 50 100 200 50 100 200 cap 0.5 (pf) 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 l . . . . w . . . . t t
11 c0g (np0) dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for higher voltage chips, see pages 24 and 25. preferred sizes are shaded size 1210 1808* 1812* 1825* 2220 2225* (l) length mm 3.20 .20 4.57 .25 4.50 .30 4.50 .30 5.7 .40 5.72 .25 (in.) (.126 .008) (.180 .010) (.177 .012) (.177 .012) (.225 .016) (.225 .010) (w) width mm 2.50 .20 2.03 .25 3.20 .20 6.40 .40 5.0 .40 6.35 .25 (in.) (.098 .008) (.080 .010) (.126 .008) (.252 .016) (.197 .016) (.250 .010) (t) max. thickness mm 1.70 1.52 1.70 1.70 2.30 1.70 (in.) (.067) (.060) (.067) (.067) (.090) (.067) (t) terminal mm .50 .25 .64 .39 .61 .36 .61 .36 .64 .39 .64 .39 (in.) (.020 .010) (.025 .015) (.024 .014) (.024 .014) (.025 .015) (.025 .015) wvdc 25 50 100 200 50 100 200 25 50 100 200 50 100 200 50 100 200 50 100 200 cap 560 (pf) 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 cap. .010 (?) .012 .015 .018 .022 .027 .033 .039 .047 .068 l . . . . w . . . . t t
12 x7r dielectric general specifications x7r formulations are called ?emperature-stable ceramics and fall into eia class ii materials. x7r is the most popular of these intermediate dielectric-constant materials. its temperature variation of capacitance is with- in ?5% from -55? to +125?. this capacitance change is non-linear. capacitance for x7r varies under the influence of elec- trical operating conditions such as voltage and frequency. it also varies with time, approximately 1% ? c per decade of time, representing about 5% change in ten years. x7r dielectric chip usage covers the broad spectrum of industrial applications where known changes in capaci- tance due to applied voltages are acceptable. capacitance range 100 pf to 2.2 ? (1.0 ?.2 vrms, 1khz) capacitance tolerances preferred ?0%, ?0% others available: ?%, +80 ?0% operating temperature range -55? to +125? temperature characteristic ?5% (0 vdc) voltage ratings 10, 16, 25, 50, 100 vdc (+125?) dissipation factor for 50 volts and 100 volts: 2.5% max. for 25 volts: 3.0% max. for 16 volts: 3.5% max. for 10 volts: 5% max. insulation resistance (+25?, rvdc) 100,000 megohms min. or 1000 m - ? min., whichever is less insulation resistance (+125?, rvdc) 10,000 megohms min. or 100 m - ? min., whichever is less aging rate < 1% per decade hour dielectric strength 250% of rated voltage for 5 seconds at 50 mamp max. current test voltage 1.0 0.2 vrms test frequency 1 khz performance characteristics 0805 size (l" x w") 5 voltage 10v = z 16v = y 25v = 3 50v = 5 100v = 1 c dielectric x7r = c 103 capacitance code m capacitance tolerance preferred m = 20% k = ?0% a failure rate a = not applicable t terminations t = plated ni and solder 2 packaging 2 = 7" reel paper/unmarked a special code a = std. product part number (see page 7 for complete information and options)
13 x7r dielectric typical characteristic curves** % d capacitance +12 0 -6 -75 -50 -25 0 +25 +50 +75 +100 +125 temperature c temperature coefficient +6 -12 -18 -24 % d capacitance +10 +20 0 -10 -20 1khz 10 khz 100 khz 1 mhz 10 mhz fre q uenc y d capacitance vs. frequency insulation resistance (ohm-farads) 1,000 10,000 100 0 +20 +25 +40 +60 +80 temperature c insulation resistance vs temperature +100 impedance, v 10 100 1000 frequency, mhz variation of impedance with cap value impedance vs. frequency 1,000 pf vs. 10,000 pf - x7r 0805 0.10 0.01 1.00 1,000 pf 10,000 pf 10.00 impedance, v 110 100 1,000 frequency, mhz variation of impedance with chip size impedance vs. frequency 100,000 pf - x7r 0.1 .01 1.0 1206 0805 10 1210 impedance, v 110 100 1,000 frequency, mhz variation of impedance with chip size impedance vs. frequency 10,000 pf - x7r 0.1 .01 1.0 1206 0805 10 1210 summary of capacitance ranges vs. chip size style 10v 16v 25v 50v 100v 0402* 100pf - 47nf 100pf - 6.8nf 100pf - 3.9nf 0504 100pf - .01? 100pf - 3.3nf 0603* 100pf - 0.22? 100pf - 0.1? 100pf - 47nf 100pf - 15nf 100pf - 4.7nf 0805* 100pf - 1? 100pf - 0.47? 100pf - 0.22? 100pf - 0.1? 100pf - 22nf 1206* 1.5? - 2.2? 1nf - 1? 1nf - 0.47? 1nf - 0.22? 1nf - 0.1? 1210* ? 1nf - 1.8? 1nf - 1? 1nf - 0.22? 1nf - 0.1? 1505 ??? 1nf - 0.1? 1nf - 27nf 1808 ?? 10nf - 0.33? 10nf - 0.33? 10nf - 0.1? 1812* ??? 10nf - 1? 10nf - 0.47? 1825* ??? 10nf - 1? 10nf - 0.47? 2220 ??? 10nf - 1.5? 10nf - 1.2? 2225 ??? 10nf - 2.2? 10nf - 1.5? * standard sizes **for additional information on performance changes with operating conditions consult avx? software spicap.
14 x7r dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for higher voltage chips, see pages 24 and 25. preferred sizes are shaded size 0402* 0504* 0603* 0805 1206 1505 (l) length mm 1.00 .10 1.27 .25 1.60 .15 2.01 .20 3.20 .20 3.81 .25 (in.) (.040 .004) (.050 .010) (.063 .006) (.079 .008) (.126 .008) (.150 .010) (w) width mm .50 .10 1.02 .25 .81 .15 1.25 .20 1.60 .20 1.27 .25 (in.) (.020 .004) (.040 .010) (.032 .006) (.049 .008) (.063 .008) (.050 .010) (t) max. thickness mm .60 1.02 .90 1.30 1.50 1.27 (in.) (.024) (.040) (.035) (.051) (.059) (.050) (t) terminal mm .25 .15 .38 .13 .35 .15 .50 .25 .50 .25 .50 .25 (in.) (.010 .006) (.015 .005) (.014 .006) (.020 .010) (.020 .010) (.020 .010) wvdc 16 25 50 50 100 10 16 25 50 100 10 16 25 50 100 10 16 25 50 100 50 100 cap 100 (pf) 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 cap. .010 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 l . . . . w . . . . t t
15 x7r dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for higher voltage chips, see pages 24 and 25. preferred sizes are shaded size 1210 1808* 1812* 1825* 2220 2225* (l) length mm 3.20 .20 4.57 .25 4.50 .30 4.50 .30 5.7 0.4 5.72 .25 (in.) (.126 .008) (.180 .010) (.177 .012) (.177 .012) (.225 .016) (.225 .010) (w) width mm 2.50 .20 2.03 .25 3.20 .20 6.40 .40 5.0 0.4 6.35 .25 (in.) (.098 .008) (.080 .010) (.126 .008) (.252 .016) (.197 .016) (.250 .010) (t) max. thickness mm 1.70 1.52 1.70 1.70 2.30 1.70 (in.) (.067) (.060) (.067) (.067) (.090) (.067) (t) terminal mm .50 .25 .64 .39 .61 .36 .61 .36 .64 .39 .64 .39 (in.) (.020 .010) (.025 .015) (.024 .014) (.024 .014) (.025 .015) (.025 .015) wvdc 16 25 50 100 25 50 100 50 100 50 100 50 100 200 50 100 cap 1000 (pf) 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 cap. .010 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 l . . . . w . . . . t t
16 z5u dielectric general specifications z5u formulations are ?eneral-purpose?ceramics which are meant primarily for use in limited temperature applic a - tions where small size and cost are important. they provide the highest capacitance possible in a given size for the three most popular ceramic formulations. they show wide varia- tions in capacitance under influence of environmental and electrical operating conditions. their aging rate is approx i - mately 5% per decade or 25% drop in ten years. despite their capacitance instability, z5u formulations are very popular because of their small size, low esl, low esr and excellent frequency response. these features are partic- ularly important for decoupling application where only a mini- mum capacitance value is required. capacitance range 0.01 ? to 1.0 ? capacitance tolerances preferred +80 ?0% others available: ?0%, +100 ?% operating temperature range +10? to +85? temperature characteristic +22% to ?6% max. voltage ratings 25 and 50vdc (+85?) dissipation factor 4% max. insulation resistance (+25?, rvdc) 10,000 megohms min. or 1000 m - ? min., whichever is less dielectric strength 250% of rated voltage for 5 seconds at 50 mamp max. current test voltage 0.5 0.2 vrms test frequency 1 khz performance characteristics 0805 size (l" x w") 5 voltage 25v = 3 50v = 5 e dielectric z5u = e 104 capacitance code z capacitance tolerance preferred z = +80% ?0% m = ?0% a failure rate a = not applicable t terminations t = plated ni and solder 2 packaging 2 = 7" reel paper/unmarked a special code a = std. product p a r t numbe r (see page 7 for complete information and options) fpo
17 z5u dielectric typical characteristic curves** % d capacitance +30 0 -10 +10 +25 +30 +40 +50 +55 +65 +35 +85 +45 temperature c temperature coefficient +20 +10 -30 -20 -40 -50 -60 % d capacitance -10 0 -20 -30 -40 1khz 10 khz 100 khz 1 mhz 10 mhz frequency d capacitance vs. frequency insulation resistance (ohm-farads ) 1,000 10,000 100,000 100 0 +20 +30 +40 +60 +80 temperature c nsu at i on r es i stance vs t emperature +70 +50 impedance, v 110 100 1,000 frequency, mhz variation of impedance with cap value impedance vs. frequency 1206 -z5u 0.10 0.01 1.00 100,000 pf 10,000 pf 100.00 10.00 |z| (ohms) 1 0.1 0.01 0.001 10 100 1,000 frequency, mhz variation of impedance with chip size impedance vs. frequency .33 m f - z5u 1 10 0.1 100 1000 z5u 1206 z5u 1210 z5u 1812 |z| (ohms) 1 0.1 0.01 0.001 10 100 1,000 frequency, mhz v ariation of impedance with ceramic formulation impedance vs. frequency .1 m f x7r vs. z5u 0805 1 10 0.01 0.1 100 10000 1000 x7r 0805 z5u 0805 summary of capacitance ranges vs. chip size style 25v 50v 0603* .01? - .047? .01? - .027? 0805* .01? - .12? .01? - 0.1? 1206* .01? - .33? .01? - .33? 1210* .01? - .56? .01? - .47? 1808 .01? - .56? .01? - .47? 1812* .01? - 1.0? .01? - 1.0? 1825* .01? - 1.0? .01? - 1.0? 2225 .01? - 1.0? .01? - 1.0? * standard sizes **for additional information on performance changes with operating conditions consult avx? software spicap.
18 z5u dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for low profile chips, see page 23. size 0603* 0805 1206 1210 ( l) length mm 1.60 .15 2.01 .20 3.20 .20 3.20 .20 (in.) (.063 .006) (.079 .008) (.126 .008) (.126 .008) (w) width mm .81 .15 1.25 .20 1.60 .20 2.50 .20 (in.) (.032 .006) (.049 .008) (.063 .008) (.098 .008) (t) max. thickness mm .90 1.30 1.50 1.70 (in.) (.035) (.051) (.059) (.067) (t) terminal mm .35 .15 .50 .25 .50 .25 .50 .25 (in.) (.014 .006) (.020 .010) (.020 .010) (.020 .010) wvdc 25 50 25 50 25 50 25 50 cap .010 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.5 l . . . . w . . . . t t preferred sizes are shaded
19 z5u dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for low profile chips, see page 23. size 1808* 1812* 1825* 2225* (l) length mm 04.57 .25 4.50 .30 4.50 .30 5.72 .25 (in.) (.180 .010) (.177 .012) (.177 .012) (.225 .010) (w) width mm 2.03 .25 3.20 .20 6.40 .40 6.35 .25 (in.) (.080 .010) (.126 .008) (.252 .016) (.250 .010) (t) max. thickness mm 1.52 1.70 1.70 1.70 (in.) (.060) (.067) (.067) (.067) (t) terminal mm .64 .39 .61 .36 .61 .36 .64 .39 (in.) (.025 .015) (.024 .014) (.024 .014) (.025 .015) wvdc 25 50 25 50 25 50 25 50 cap .010 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.5 l . . . . w . . . . t t preferred sizes are shades
20 y5v dielectric general specifications y5v formulations are for general-purpose use in a limited temperature range. they have a wide temperature character- istic of +22% ?2% capacitance change over the operating temperature range of ?0? to +85?. y5v? high dielectric constant allows the manufacture of very high capacitance values (up to 4.7 ?) in small physical sizes. capacitance range 2200 pf to 22 ? capacitance tolerances +80 ?0% operating temperature range ?0? to +85? temperature characteristic +22% to ?2% max. within operating temperature voltage ratings 10, 16, 25 and 50 vdc (+85?) dissipation factor for 25 volts and 50 volts: 5.0% max. for 16 volts: 7% max. for 10 volts: 10% max. insulation resistance (+25?, rvdc) 10,000 megohms min. or 1000 m - ? min., whichever is less dielectric strength 250% of rated voltage for 5 seconds at 50 mamp max. current test voltage 1.0 vrms 0.2 vrms test frequency 1 khz performance characteristics 0805 size (l" x w") 3 voltage 10v = z 16v = y 25v = 3 50v = 5 g dielectric y5v = g 104 capacitance code z capacitance tolerance z = +80 ?0% a failure rate a = not applicable t terminations t = plated ni and solder 2 packaging 2 = 7" reel paper/unmarked a special code a = std. product part number (see page 7 for complete information and options)
21 % d capacitance +20 +10 0 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 temperature c temperature coefficient -60 -50 -40 -30 -20 -10 -70 -80 d c/c (%) +20 +40 0 0 dc bias voltage capacitance change vs. dc bias voltage -60 -40 -20 -100 -80 20 40 60 80 100 y5v dielectric typical characteristic curves** insulation resistance (ohm-farads) 1,000 10,000 100 0 +20 +30 +40 +60 +50 +70 +80 +85 temperature c insulation resistance vs. temperature |z| (ohms) 10,000 1,000 10,000 frequency (hz) 0.1 m f - 0603 impedance vs. frequency 1 10 100 0.01 0.1 100,000 1,000,000 10,000,000 |z| (ohms) 1,000 10,000 frequency (hz) 0.22 m f - 0805 impedance vs. frequency 1 10 100 0.01 0.1 100,000 1,000,000 10,000,000 |z| (ohms) 1,000 10,000 frequency (hz) 1 m f - 1206 impedance vs. frequency 1 10 100 0.01 0.1 100,000 1,000,000 10,000,000 summary of capacitance ranges vs. chip size style 10v 16v 25v 50v 0402* 2.2nf - 0.1? 2.2nf - 0.1? 2.2nf - 22nf 2.2nf - 10nf 0603* 2.2nf - 1? 2.2nf - 0.33? 2.2nf - 0.22? 2.2nf - 56nf 0805* 10nf - 4.7? 10nf - 2.2? 10nf - 1? 10nf - 0.33? 1206* 10nf - 10? 10nf - 4.7? 10nf - 2.2? 10nf - 1? 1210* 10nf - 22? 0.1? - 10? 0.1? - 4.7? 0.1? - 1? 1812* ?? 0.15? - 1.5? 1.5nf - 1.5? 1825* ?? 0.47? - 1.5? 0.47? - 1.5? 2220 1? - 1.5? 2225 ?? 0.68? - 2.2? 0.68? - 1.5? * standard sizes **for additional information on performance changes with operating conditions consult avx? software spicap.
22 y5v dielectric capacitance range *ir and vapor phase soldering only recommended. notes: for low profile product, see page 23. preferred sizes are shades 16 25 50 25 50 25 50 50 25 50 size 0402* 0603* 0805 1206 1210 1812* 1825* 2220 2225* (l) length mm 1.00 .10 1.60 .15 2.01 .20 3.20 .20 3.20 .20 4.50 .30 4.50 .30 5.7 0.4 5.72 .25 (in.) (.040 .004) (.063 .006) (.079 .008) (.126 .008) (.126 .008) (.177 .012) (.252 .016) (.225 .016) (.225 .010) (w) width mm .50 .10 .81 .15 1.25 .20 1.60 .20 2.50 .20 3.20 .20 6.40 .40 5.0 0.4 6.35 .25 (in.) (.020 .004) (.032 .006) (.049 .008) (.063 .008) (.098 .008) (.126 .008) (.252 .016) (.197 .016) (.250 .010) (t) max. thickness mm .60 .90 1.30 1.50 1.70 1.70 1.70 2.30 1.70 (in.) (.024) (.035) (.051) (.059) (.067) (.067) (.067) (.090) (.067) (t) terminal mm .25 .15 .35 .15 .50 .25 .50 .25 .50 .25 .61 .36 .61 .36 .64 .39 .64 .39 (in.) (.010 .006) (.014 .006) (.020 .010) (.020 .010) (.020 .010) (.024 .014) (.024 .014) (.025 .015) (.025 .015) wvdc 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 cap 2200 (pf) 2700 3300 3900 4700 5600 6800 8200 cap .01 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 l . . . . w . . . . t t
23 y5v 1206 size (l" x w") 3 voltage 25v = 3 e dielectric z5u = e y5v = g 224 capacitance code z capacitance tolerance z = +80/-20% a failure rate a = not applicable t terminations t = plated ni and solder 2 packaging* 2 = 7" reel paper/unmarked t thickness t = .026" max. s = .022" max. r = .018" max. low profile chips z5u & y5v dielectric part number (see page 7 for complete information and options) capacitance values for various thicknesses z5u performance characteristics capacitance range z5u: .01 ?.33?; y5v: .01 ?.47? capacitance tolerances +80, -20% operating temperature range z5u: +10? to +85?; y5v: -30? to +85? temperature characteristic z5u: +22%, -56%; y5v: +22%, -82% voltage ratings 25 vdc dissipation factor 25?, .5 vrms, 1khz z5u: 4%; y5v: 5% insulation resistance 10,000 megohms min. or 1000 m - ? whichever is less dielectric strength for 250% of rated vdc 5 seconds at 50 mamp max. current test voltage z5u: 0.5 0.2 vrms y5v: 1.0 vrms 0.2 vrms test frequency 1 khz size 0805 1206 1210 (l) length mm 2.01 .20 3.2 .2 3.2 .2 (in.) (.079 .008) (.126 .008) (.126 .008) (w) width mm 1.25 .20 1.6 .2 2.5 .2 (in.) (.049 .008) (.063 .008) (.098 .008) (t) terminal mm .50 .25 .50 .25 .50 .25 (in.) (.020 .010) (.020 .010) (.020 .010) (t) thickness mm .46 .56 .66 .46 .56 .66 .46 .56 .66 max. (in.) (.018) (.022) (.026) (.018) (.022) (.026) (.018) (.022) (.026) cap .01 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .1 .12 .15 .18 .22 .27 .33 .39 .47 size 0805 1206 1210 ( l) length mm 2.01 ?20 3.2 ?2 3.2 ?2 (in.) (.079 .008) (.126 .008) (.126 .008) (w) width mm 1.25 ?20 1.6 ?2 2.5 ?2 (in.) (.049 .008) (.063 .008) (.098 .008) (t) terminal mm .50 .25 .50 .25 .50 .25 (in.) (.020 .010) (.020 .010) (.020 .010) (t) thickness mm .46 .56 .66 .46 .56 .66 .46 .56 .66 max. (in.) (.018) (.022) (.026) (.018) (.022) (.026) (.018) (.022) (.026) cap .01 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .1 .12 .15 .18 .22 .27 .33 .39 .47
24 1808 avx style 1206 1210 1808 1812 1825 2225 3640 a voltage 500v = 7 600v = c 1000v = a 1500v = s 2000v = g 2500v = w 3000v = h 4000v = j 5000v = k a temperature coefficient c0g = a x7r = c 271 capacitance code (2 significant digits + no. of zeros) examples: k capacitance tolerance a failure rate a=not applicable 1 termination 1= pd/ag t= plated ni and solder 1 packaging a special code a = standard high voltage chips for 500v to 5000v applications high value, low leakage and small size are difficult para- meters to obtain in capacitors for high voltage systems. avx special high voltage mlc chips capacitors meet these performance characteristics and are designed for applica- tions such as snubbers in high frequency power converters, resonators in smps, and high voltage coupling/dc block- ing. these high voltage chip designs exhibit low esrs at high frequencies. larger physical sizes than normally encountered chips are used to make high voltage chips. these larger sizes require that special precautions be taken in applying these chips in surface mount assemblies. this is due to differ- ences in the coefficient of thermal expansion (cte) between the substrate materials and chip capacitors. part number (see page 7 for complete information and options) 10pf = 100 100pf = 101 1,000pf = 102 22,000pf = 223 220,000pf = 224 1? = 105 c0g: j= ?% k= ?0% m= ?0% x7r: k= ?0% m= ?0% z= +80% - 20% 1 = 7" reel embossed tape 3 = 13" reel embossed tape 9 = bulk
25 voltage 1206 1210 1808 1812 1825 2225 3640 500 560 pf 820 pf 3300 pf 5600 pf .012 ? .018 ? 600 3300 pf 5600 pf .012 ? .018 ? .047 ? 1000 1500 pf 2200 pf 5600 pf 8200 pf .018 ? 1500 330 pf 560 pf 1500 pf 1800 pf 5600 pf 2000 270 pf 470 pf 1200 pf 1500 pf 4700 pf 2500 100 pf 220 pf 560 pf 820 pf 2700 pf 3000 82 pf 180 pf 270 pf 680 pf 2200 pf 4000 1000 pf 5000 680 pf c0g (np0) maximum capacitance values voltage 1206 1210 1808 1812 1825 2225 3640 500 6800 pf .022 ? .056 ? 600 .039 ? .068 ? .15 ? .22 ? .56 ? 1000 .015 ? .027 ? .068 ? .082 ? .22 ? 1500 2700 pf 5600 pf .012 ? .018 ? .056 ? 2000 1500 pf 2700 pf 6800 pf .010 ? .027 ? 2500 1200 pf 2200 pf 5600 pf 8200 pf .022 ? 3000 4700 pf .018 ? 4000 5600 pf x7r maximum capacitance values x7r dielectric capacitance range 100 pf to .047 ? (25?, 1.0 ?.2 vrms at 1khz) capacitance tolerances ?%, ?0%, ?0% dissipation factor 0.1% max. (+25?, 1.0 ?.2 vrms, 1khz) operating temperature range ?5? to +125? temperature characteristic 0 ?0 ppm/? (0 vdc) voltage ratings 500, 600, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 vdc (+125?) insulation resistance (+25?, at 500 vdc) 100,000 megohms min. or 1000 m - ? min., whichever is less insulation resistance (+125?, at 500 vdc) 10,000 megohms min. or 100 m - ? min., whichever is less dielectric strength 120% rated voltage for 5 seconds at 50 mamp max. current thickness dependent upon size, voltage, and capacitance value performance characteristics capacitance range 1000 pf to 0.56 ? (25?, 1.0 ?.2 vrms at 1k hz) capacitance tolerances ?0%, ?0%, +80% -20% dissipation factor 2.5% max. (+25?, 1.0 ?.2 vrms, 1khz) operating temperature range ?5? to +125? temperature characteristic ?5% (0 vdc) voltage ratings 500, 600, 1000, 1500, 2000, 2500, 3000 & 4000 vdc (+125?) insulation resistance (+25?, at 500 vdc) 100,000 megohms min. or 1000 m - ? min., whichever is less insulation resistance (+125?, at 500 vdc) 10,000 megohms min. or 100 m - ? min., whichever is less dielectric strength 120% rated voltage for 5 seconds at 50 mamp max. current thickness dependent upon size, voltage, and capacitance value performance characteristics high voltage chips for 500v to 5000v applications np0 dielectric
general specifications mechanical specification no evidence of peeling of end terminal measuring conditions after soldering devices to circuit board apply 5n (0.51kg f) for 10 1 seconds, please refer to figure 1. specification appearance: no visual defects capacitance within specified tolerance q, tan delta to meet initial requirement insulation resistance np0, x7r $ initial value x 0.3 z5u, y5v $ initial value x 0.1 measuring conditions vibration frequency 10-2000 hz maximum acceleration 20g swing width 1.5mm test time x, y, z axis for 2 hours each, total 6 hours of test end termination adherence resistance to vibration specification $ 95% of each termination end should be covered with fresh solder measuring conditions dip device in eutectic solder at 230 5? for 2 .5 seconds figure 2. bend strength figure 1. terminal adhesion solderability specification appearance: no visual defects capacitance variation np0: 5% or .5pf, whichever is larger x7r: 12% z5u: 30% y5v: 30% insulation resistance np0: 3 initial value x 0.3 x7r: 3 initial value x 0.3 z5u: 3 initial value x 0.1 y5v: 3 initial value x 0.1 measuring conditions please refer to figure 2 deflection: 2mm test time: 30 seconds bend strength specification appearance: no serious defects, <25% leaching of either end terminal capacitance variation np0: 2.5% or 2.5pf, whichever is greater x7r: ?.5% z5u: 20% y5v: 20% q, tan delta to meet initial requirement insulation resistance to meet initial requirement dielectric strength no problem observed measuring conditions dip device in eutectic solder at 260?, for 1 minute. store at room temperature for 48 hours (24 hours for np0) before measuring electrical parameters. part sizes larger than 3.20mm x 2.49mm are preheated at 150? for 30 ? seconds before performing test. resistance to solder heat speed = 1mm/sec r340mm supports 2mm deflection 45mm 45mm 5n force device under test test board 26
specification appearance no visual defects capacitance variation np0: 2.5% or .25pf, whichever is greater x7r: ?.5% z5u: 20% y5v: 20% q, tan delta to meet initial requirement insulation resistance np0, x7r: to meet initial requirement z5u, y5v: 3 initial value x 0.1 dielectric strength no problem observed measuring conditions step temperature ? time (minutes) 1 +65 +5/-0 15 2 pure water 2 0 3 15 2 nacl solution repeat cycle 2 times and wash with water and dry. store at room temperature for 48 4 hours (24 hours for np0) and measure. general specifications environmental specification appearance no visual defects capacitance variation np0: 2.5% or .25pf, whichever is greater x7r: ?.5% z5u: 20% y5v: 20% q, tan delta to meet initial requirement insulation resistance np0, x7r: to meet initial requirement z5u, y5v: 3 initial value x 0.1 dielectric strength no problem observed measuring conditions step temperature ? time (minutes) np0, x7r: -55 2 1 z5u: +10 2 30 3 y5v: -30 2 2 room temperature # 3 3 np0, x7r: +125 2 30 3 z5u, y5v: +85 2 4 room temperature # 3 repeat for 5 cycles and measure after 48 hours 4 hours (24 hours for np0) at room temperature. thermal shock immersion moisture resistance specification appearance no visual defects capacitance variation np0: 5% or .5pf, whichever is greater x7r: 10% z5u: 30% y5v: 30% q, tan delta np0: 3 30pf .......................q 3 350 3 10pf, < 30pf ...........q 3 275+5c/2 < 10pf .......................q 3 200+10c x7r: initial requirement + .5% z5u: initial requirement + 1% y5v: initial requirement + 2% insulation resistance 3 initial value x 0.3 measuring conditions step temp. ? humidity % time (hrs) 1 +25->+65 90-98 2.5 2 +65 90-98 3.0 3 +65->+25 80-98 2.5 4 +25->+65 90-98 2.5 5 +65 90-98 3.0 6 +65->+25 80-98 2.5 7 +25 90-98 2.0 7a -10 uncontrolled 7b +25 90-98 repeat 20 cycles (1-7) and store for 48 hours (24 hours for np0) at room temperature before measuring. steps 7a & 7b are done on any 5 out of first 9 cycles. 27
28 general specifications environmental specification appearance no visual defects capacitance variation np0: 5% or .5pf, whichever is greater x7r: 10% z5u: 30% y5v: 30% q, tan delta np0: 3 30pf .......................q 3 350 3 10pf, < 30pf ...........q 3 275+5c/2 < 10pf .......................q 3 200+10c x7r: initial requirement + .5% z5u: initial requirement + 1% y5v: initial requirement + 2% insulation resistance 3 initial value x 0.3 measuring conditions store at 85 5% relative humidity and 85? for 1000 hours, without voltage. remove from test chamber and stabilize at room temperature and humidity for 48 4 hours (24 ? hours for np0) before measuring. charge and discharge currents must be less than 50ma. steady state humidity (no load) specification appearance no visual defects capacitance variation np0: 5% or .5pf, whichever is greater x7r: 10% z5u: 30% y5v: 30% q, tan delta np0: 3 30pf .......................q 3 350 3 10pf, < 30pf ...........q 3 275+5c/2 < 10pf .......................q 3 200+10c x7r: initial requirement + .5% z5u: initial requirement + 1% y5v: initial requirement + 2% load humidity specification appearance no visual defects capacitance variation np0: 3% or .3pf, whichever is greater x7r: 10% z5u: 30% y5v: 30% q, tan delta np0: 3 30pf .......................q 3 350 3 10pf, < 30pf ...........q 3 275+5c/2 < 10pf .......................q 3 200+10c x7r: initial requirement + .5% z5u: initial requirement + 1% y5v: initial requirement + 2% insulation resistance np0, x7r: to meet initial value x 0.3 z5u, y5v: 3 initial value x 0.1 charge devices with twice rated voltage in test chamber set at +125? 2? for np0 and x7r, +85 2? for z5u, and y5v for 1000 (+48,-0) hours. remove from test chamber and stabilize at room temperature for 48 4 hours (24 ? hours for np0) before measuring. charge and discharge currents must be less than 50ma. load life insulation resistance np0, x7r: to meet initial value x 0.3 z5u, y5v: 3 initial value x 0.1 charge devices with rated voltage in test chamber set at 85 5% relative humidity and 85? for 1000 (+48,-0) hours. remove from test chamber and stabilize at room temperature and humidity for 48 4 hours (24 ? hours for np0) before measuring. charge and discharge currents must be less than 50ma.
29 mil-c-55681/chips part number example t w l d t military designation per mil-c-55681 part number example (example) cdr01 bp 101 b k s m mil style voltage-temperature limits capacitance rated voltage capacitance tolerance termination finish failure rate mil style: cdr01, cdr02, cdr03, cdr04, cdr05, cdr06 voltage temperature limits: bp = 0 30 ppm/? without voltage; 0 30 ppm/? with rated voltage from -55? to +125? bx = 15% without voltage; +15 ?5% with rated voltage from -55? to +125? capacitance: two digit figures followed by multiplier (number of zeros to be added) e.g., 101 = 100 pf rated voltage: a = 50v, b = 100v capacitance tolerance: j ?%, k ?0%, m ?0% termination finish: m = palladium silver u = base metallization/barrier n = silver nickel gold metal/solder coated* s = solder-coated w = base metallization/barrier metal/tinned (tin or tin/ lead alloy) failure rate level: m = 1.0%, p = .1%, r = .01%, s = .001% packaging: bulk is standard packaging. tape and reel per rs481 is available upon request. *solder shall have a melting point of 200? or less. cross reference: avx/mil-c-55681/cdr01 thru cdr06* per mil-c-55681 avx length (l) width (w) thickness (t) d termination band (t) style max. min. max. min. max. min. cdr01 0805 .080 .015 .050 .015 .055 .020 .030 .010 cdr02 1805 .180 .015 .050 .015 .055 .020 .030 .010 cdr03 1808 .180 .015 .080 .018 .080 .020 .030 .010 cdr04 1812 .180 .015 .125 .015 .080 .020 .030 .010 cdr05 1825 .180 +.020 .250 +.020 .080 .020 .030 .010 -.015 -.015 cdr06 2225 .225 .020 .250 .020 .080 .020 .030 .010 *for cdr11, 12, 13, and 14 see avx microwave chip capacitor catalog
30 mil-c-55681/chips military part number identification cdr01 thru cdr06 cdr01 thru cdr06 to mil-c-55681 military rated temperature wvdc type capacitance capacitance and voltage- designation in pf tolerance temperature limits avx style 0805/cdr01 cdr01bp100b--- 10 j,k bp 100 cdr01bp120b--- 12 j bp 100 cdr01bp150b--- 15 j,k bp 100 cdr01bp180b--- 18 j bp 100 cdr01bp220b--- 22 j,k bp 100 cdr01bp270b--- 27 j bp 100 cdr01bp330b--- 33 j,k bp 100 cdr01bp390b--- 39 j bp 100 cdr01bp470b--- 47 j,k bp 100 cdr01bp560b--- 56 j bp 100 cdr01bp680b--- 68 j,k bp 100 cdr01bp820b--- 82 j bp 100 cdr01bp101b--- 100 j,k bp 100 cdr01b--121b--- 120 j,k bp,bx 100 cdr01b--151b--- 150 j,k bp,bx 100 cdr01b--181b--- 180 j,k bp,bx 100 cdr01bx221b--- 220 k,m bx 100 cdr01bx271b--- 270 k bx 100 cdr01bx331b--- 330 k,m bx 100 cdr01bx391b--- 390 k bx 100 cdr01bx471b--- 470 k,m bx 100 cdr01bx561b--- 560 k bx 100 cdr01bx681b--- 680 k,m bx 100 cdr01bx821b--- 820 k bx 100 cdr01bx102b--- 1000 k,m bx 100 cdr01bx122b--- 1200 k bx 100 cdr01bx152b--- 1500 k,m bx 100 cdr01bx182b--- 1800 k bx 100 cdr01bx222b--- 2200 k,m bx 100 cdr01bx272b--- 2700 k bx 100 cdr01bx332b--- 3300 k,m bx 100 cdr01bx392a--- 3900 k bx 50 cdr01bx472a--- 4700 k,m bx 50 avx style 1805/cdr02 cdr02bp221b--- 220 j,k bp 100 cdr02bp271b--- 270 j bp 100 cdr02bx392b--- 3900 k bx 100 cdr02bx472b--- 4700 k,m bx 100 cdr02bx562b--- 5600 k bx 100 cdr02bx682b--- 6800 k,m bx 100 cdr02bx822b--- 8200 k bx 100 cdr02bx103b--- 10,000 k,m bx 100 cdr02bx123a--- 12,000 k bx 50 cdr02bx153a--- 15,000 k,m bx 50 cdr02bx183a--- 18,000 k bx 50 cdr02bx223a--- 22,000 k,m bx 50 add appropriate failure rate add appropriate termination finish capacitance tolerance military rated temperature wvdc type capacitance capacitance and voltage- designation in pf tolerance temperature limits avx style 1808/cdr03 cdr03bp331b--- 330 j,k bp 100 cdr03bp391b--- 390 j bp 100 cdr03bp471b--- 470 j,k bp 100 cdr03bp561b--- 560 j bp 100 cdr03bp681b--- 680 j,k bp 100 cdr03bp821b-- 820 j bp 100 cdr03bp102b--- 1000 j,k bp 100 cdr03bx123b-- 12,000 k bx 100 cdr03bx153b--- 15,000 k,m bx 100 cdr03bx183b--- 18,000 k bx 100 cdr03bx223b--- 22,000 k,m bx 100 cdr03bx273b--- 27,000 k bx 100 cdr03bx333b--- 33,000 k,m bx 100 cdr03bx393a--- 39,000 k bx 50 cdr03bx473a--- 47,000 k,m bx 50 cdr03bx563a--- 56,000 k bx 50 cdr03bx683a--- 68,000 k,m bx 50 avx style 1812/cdr04 cdr04bp122b--- 1200 j bp 100 cdr04bp152b--- 1500 j,k bp 100 cdr04bp182b--- 1800 j bp 100 cdr04bp222b--- 2200 j,k bp 100 cdr04bp272b--- 2700 j bp 100 cdr04bp332b--- 3300 j,k bp 100 cdr04bx393b--- 39,000 k bx 100 cdr04bx473b--- 47,000 k,m bx 100 cdr04bx563b--- 56,000 k bx 100 cdr04bx823a--- 82,000 k bx 50 cdr04bx104a--- 100,000 k,m bx 50 cdr04bx124a--- 120,000 k bx 50 cdr04bx154a--- 150,000 k,m bx 50 cdr04bx184a--- 180,000 k bx 50 avx style 1825/cdr05 cdr05bp392b--- 3900 j,k bp 100 cdr05bp472b--- 4700 j,k bp 100 cdr05bp562b--- 5600 j,k bp 100 cdr05bx683b--- 68,000 k,m bx 100 cdr05bx823b--- 82,000 k bx 100 cdr05bx104b--- 100,000 k,m bx 100 cdr05bx124b--- 120,000 k bx 100 cdr05bx154b--- 150,000 k,m bx 100 cdr05bx224a--- 220,000 k,m bx 50 cdr05bx274a--- 270,000 k bx 50 cdr05bx334a--- 330,000 k,m bx 50 avx style 2225/cdr06 cdr06bp682b--- 6800 j,k bp 100 cdr06bp822b--- 8200 j,k bp 100 cdr06bp103b--- 10,000 j,k bp 100 cdr06bx394a--- 390,000 k bx 50 cdr06bx474a--- 470,000 k,m bx 50 add appropriate failure rate add appropriate termination finish capacitance tolerance
31 mil-c-55681/chips military part number identification cdr31 thru cdr35 t w l d t military designation per mil-c-55681 part number example (example) cdr31 bp 101 b k s m mil style voltage-temperature limits capacitance rated voltage capacitance tolerance termination finish failure rate mil style: cdr31, cdr32, cdr33, cdr34, cdr35 voltage temperature limits: bp = 0 30 ppm/? without voltage; 0 30 ppm/? with rated voltage from -55? to +125? bx = 15% without voltage; +15 ?5% with rated voltage from -55? to +125? capacitance: two digit figures followed by multiplier (number of zeros to be added) e.g., 101 = 100 pf rated voltage: a = 50v, b = 100v capacitance tolerance: c ?25 pf, d ?5 pf, f ?% j ?%, k ?0%, m ?0% termination finish: m = palladium silver u = base metallization/barrier n = silver nickel gold metal/solder coated* s = solder-coated w = base metallization/barrier metal/tinned (tin or tin/ lead alloy) *solder shall have a melting point of 200? or less. failure rate level: m = 1.0%, p = .1%, r = .01%, s = .001% packaging: bulk is standard packaging. tape and reel per rs481 is available upon request. cross reference: avx/mil-c-55681/cdr31 thru cdr35 per mil-c-55681 avx length (l) width (w) thickness (t) d termination band (t) (metric sizes) style (mm) (mm) max. (mm) min. (mm) max. (mm) min. (mm) cdr31 0805 2.00 1.25 1.3 .50 .70 .30 cdr32 1206 3.20 1.60 1.3 .70 .30 cdr33 1210 3.20 2.50 1.5 .70 .30 cdr34 1812 4.50 3.20 1.5 .70 .30 cdr35 1825 4.50 6.40 1.5 .70 .30
32 mil-c-55681/chips military part number identification cdr31 cdr31 to mil-c-55681/7 military rated temperature wvdc type capacitance capacitance and voltage- designation 1 / in pf tolerance temperature limits avx style 0805/cdr31 (bp) cdr31bp1r0b--- 1.0 c bp 100 cdr31bp1r1b--- 1.1 c bp 100 cdr31bp1r2b--- 1.2 c bp 100 cdr31bp1r3b--- 1.3 c bp 100 cdr31bp1r5b--- 1.5 c bp 100 cdr31bp1r6b--- 1.6 c bp 100 cdr31bp1r8b--- 1.8 c bp 100 cdr31bp2r0b--- 2.0 c bp 100 cdr31bp2r2b--- 2.2 c bp 100 cdr31bp2r4b--- 2.4 c bp 100 cdr31bp2r7b--- 2.7 c,d bp 100 cdr31bp3r0b--- 3.0 c,d bp 100 cdr31bp3r3b--- 3.3 c,d bp 100 cdr31bp3r6b--- 3.6 c,d bp 100 cdr31bp3r9b--- 3.9 c,d bp 100 cdr31bp4r3b--- 4.3 c,d bp 100 cdr31bp4r7b--- 4.7 c,d bp 100 cdr31bp5r1b--- 5.1 c,d bp 100 cdr31bp5r6b--- 5.6 c,d bp 100 cdr31bp6r2b--- 6.2 c,d bp 100 cdr31bp6r8b--- 6.8 c,d bp 100 cdr31bp7r5b--- 7.5 c,d bp 100 cdr31bp8r2b--- 8.2 c,d bp 100 cdr31bp9r1b--- 9.1 c,d bp 100 cdr31bp100b--- 10 j,k bp 100 cdr31bp110b--- 11 j,k bp 100 cdr31bp120b--- 12 j,k bp 100 cdr31bp130b--- 13 j,k bp 100 cdr31bp150b--- 15 j,k bp 100 cdr31bp160b--- 16 j,k bp 100 cdr31bp180b--- 18 j,k bp 100 cdr31bp200b--- 20 j,k bp 100 cdr31bp220b--- 22 j,k bp 100 cdr31bp240b--- 24 j,k bp 100 cdr31bp270b--- 27 f,j,k bp 100 cdr31bp300b--- 30 f,j,k bp 100 cdr31bp330b--- 33 f,j,k bp 100 cdr31bp360b--- 36 f,j,k bp 100 cdr31bp390b--- 39 f,j,k bp 100 cdr31bp430b--- 43 f,j,k bp 100 cdr31bp470b--- 47 f,j,k bp 100 cdr31bp510b--- 51 f,j,k bp 100 cdr31bp560b--- 56 f,j,k bp 100 cdr31bp620b--- 62 f,j,k bp 100 cdr31bp680b--- 68 f,j,k bp 100 cdr31bp750b--- 75 f,j,k bp 100 cdr31bp820b--- 82 f,j,k bp 100 cdr31bp910b--- 91 f,j,k bp 100 military rated temperature wvdc type capacitance capacitance and voltage- designation 1 / in pf tolerance temperature limits avx style 0805/cdr31 (bp) cont? cdr31bp101b--- 100 f,j,k bp 100 cdr31bp111b--- 110 f,j,k bp 100 cdr31bp121b--- 120 f,j,k bp 100 cdr31bp131b--- 130 f,j,k bp 100 cdr31bp151b--- 150 f,j,k bp 100 cdr31bp161b--- 160 f,j,k bp 100 cdr31bp181b--- 180 f,j,k bp 100 cdr31bp201b--- 200 f,j,k bp 100 cdr31bp221b--- 220 f,j,k bp 100 cdr31bp241b--- 240 f,j,k bp 100 cdr31bp271b--- 270 f,j,k bp 100 cdr31bp301b--- 300 f,j,k bp 100 cdr31bp331b--- 330 f,j,k bp 100 cdr31bp361b--- 360 f,j,k bp 100 cdr31bp391b--- 390 f,j,k bp 100 cdr31bp431b--- 430 f,j,k bp 100 cdr31bp471b--- 470 f,j,k bp 100 cdr31bp511a--- 510 f,j,k bp 50 cdr31bp561a--- 560 f,j,k bp 50 cdr31bp621a--- 620 f,j,k bp 50 cdr31bp681a--- 680 f,j,k bp 50 avx style 0805/cdr31 (bx) cdr31bx471b--- 470 k,m bx 100 cdr31bx561b--- 560 k,m bx 100 cdr31bx681b--- 680 k,m bx 100 cdr31bx821b--- 820 k,m bx 100 cdr31bx102b--- 1,000 k,m bx 100 cdr31bx122b--- 1,200 k,m bx 100 cdr31bx152b--- 1,500 k,m bx 100 cdr31bx182b--- 1,800 k,m bx 100 cdr31bx222b--- 2,200 k,m bx 100 cdr31bx272b--- 2,700 k,m bx 100 cdr31bx332b--- 3,300 k,m bx 100 cdr31bx392b--- 3,900 k,m bx 100 cdr31bx472b--- 4,700 k,m bx 100 cdr31bx562a--- 5,600 k,m bx 50 cdr31bx682a--- 6,800 k,m bx 50 cdr31bx822a--- 8,200 k,m bx 50 cdr31bx103a--- 10,000 k,m bx 50 cdr31bx123a--- 12,000 k,m bx 50 cdr31bx153a--- 15,000 k,m bx 50 cdr31bx183a--- 18,000 k,m bx 50 1 / the complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level. add appropriate failure rate add appropriate termination finish capacitance tolerance add appropriate failure rate add appropriate termination finish capacitance tolerance
33 mil-c-55681/chips military part number identification cdr32 cdr32 to mil-c-55681/8 military rated temperature wvdc type capacitance capacitance and voltage- designation 1 / in pf tolerance temperature limits avx style 1206/cdr32 (bp) cdr32bp1r0b--- 1.0 c bp 100 cdr32bp1r1b--- 1.1 c bp 100 cdr32bp1r2b--- 1.2 c bp 100 cdr32bp1r3b--- 1.3 c bp 100 cdr32bp1r5b--- 1.5 c bp 100 cdr32bp1r6b--- 1.6 c bp 100 cdr32bp1r8b--- 1.8 c bp 100 cdr32bp2r0b--- 2.0 c bp 100 cdr32bp2r2b--- 2.2 c bp 100 cdr32bp2r4b--- 2.4 c bp 100 cdr32bp2r7b--- 2.7 c,d bp 100 cdr32bp3r0b--- 3.0 c,d bp 100 cdr32bp3r3b--- 3.3 c,d bp 100 cdr32bp3r6b--- 3.6 c,d bp 100 cdr32bp3r9b--- 3.9 c,d bp 100 cdr32bp4r3b--- 4.3 c,d bp 100 cdr32bp4r7b--- 4.7 c,d bp 100 cdr32bp5r1b--- 5.1 c,d bp 100 cdr32bp5r6b--- 5.6 c,d bp 100 cdr32bp6r2b--- 6.2 c,d bp 100 cdr32bp6r8b--- 6.8 c,d bp 100 cdr32bp7r5b--- 7.5 c,d bp 100 cdr32bp8r2b--- 8.2 c,d bp 100 cdr32bp9r1b--- 9.1 c,d bp 100 cdr32bp100b--- 10 j,k bp 100 cdr32bp110b--- 11 j,k bp 100 cdr32bp120b--- 12 j,k bp 100 cdr32bp130b--- 13 j,k bp 100 cdr32bp150b--- 15 j,k bp 100 cdr32bp160b--- 16 j,k bp 100 cdr32bp180b--- 18 j,k bp 100 cdr32bp200b--- 20 j,k bp 100 cdr32bp220b--- 22 j,k bp 100 cdr32bp240b--- 24 j,k bp 100 cdr32bp270b--- 27 f,j,k bp 100 cdr32bp300b--- 30 f,j,k bp 100 cdr32bp330b--- 33 f,j,k bp 100 cdr32bp360b--- 36 f,j,k bp 100 cdr32bp390b--- 39 f,j,k bp 100 cdr32bp430b--- 43 f,j,k bp 100 cdr32bp470b--- 47 f,j,k bp 100 cdr32bp510b--- 51 f,j,k bp 100 cdr32bp560b--- 56 f,j,k bp 100 cdr32bp620b--- 62 f,j,k bp 100 cdr32bp680b--- 68 f,j,k bp 100 cdr32bp750b--- 75 f,j,k bp 100 cdr32bp820b--- 82 f,j,k bp 100 cdr32bp910b--- 91 f,j,k bp 100 military rated temperature wvdc type capacitance capacitance and voltage- designation 1 / in pf tolerance temperature limits avx style 1206/cdr32 (bp) cont? cdr32bp101b--- 100 f,j,k bp 100 cdr32bp111b--- 110 f,j,k bp 100 cdr32bp121b--- 120 f,j,k bp 100 cdr32bp131b--- 130 f,j,k bp 100 cdr32bp151b--- 150 f,j,k bp 100 cdr32bp161b--- 160 f,j,k bp 100 cdr32bp181b--- 180 f,j,k bp 100 cdr32bp201b--- 200 f,j,k bp 100 cdr32bp221b--- 220 f,j,k bp 100 cdr32bp241b--- 240 f,j,k bp 100 cdr32bp271b--- 270 f,j,k bp 100 cdr32bp301b--- 300 f,j,k bp 100 cdr32bp331b--- 330 f,j,k bp 100 cdr32bp361b--- 360 f,j,k bp 100 cdr32bp391b--- 390 f,j,k bp 100 cdr32bp431b--- 430 f,j,k bp 100 cdr32bp471b--- 470 f,j,k bp 100 cdr32bp511b--- 510 f,j,k bp 100 cdr32bp561b--- 560 f,j,k bp 100 cdr32bp621b--- 620 f,j,k bp 100 cdr32bp681b--- 680 f,j,k bp 100 cdr32bp751b--- 750 f,j,k bp 100 cdr32bp821b--- 820 f,j,k bp 100 cdr32bp911b--- 910 f,j,k bp 100 cdr32bp102b--- 1,000 f,j,k bp 100 cdr32bp112a--- 1,100 f,j,k bp 50 cdr32bp122a--- 1,200 f,j,k bp 50 cdr32bp132a--- 1,300 f,j,k bp 50 cdr32bp152a--- 1,500 f,j,k bp 50 cdr32bp162a--- 1,600 f,j,k bp 50 cdr32bp182a--- 1,800 f,j,k bp 50 cdr32bp202a--- 2,000 f,j,k bp 50 cdr32bp222a--- 2,200 f,j,k bp 50 avx style 1206/cdr32 (bx) cdr32bx472b--- 4,700 k,m bx 100 cdr32bx562b--- 5,600 k,m bx 100 cdr32bx682b--- 6,800 k,m bx 100 cdr32bx822b--- 8,200 k,m bx 100 cdr32bx103b--- 10,000 k,m bx 100 cdr32bx123b--- 12,000 k,m bx 100 cdr32bx153b--- 15,000 k,m bx 100 cdr32bx183a--- 18,000 k,m bx 50 cdr32bx223a--- 22,000 k,m bx 50 cdr32bx273a--- 27,000 k,m bx 50 cdr32bx333a--- 33,000 k,m bx 50 cdr32bx393a--- 39,000 k,m bx 50 1 / the complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level. add appropriate failure rate add appropriate termination finish capacitance tolerance add appropriate failure rate add appropriate termination finish capacitance tolerance
34 mil-c-55681/chips military part number identification cdr33/34/35 cdr33/34/35 to mil-c-55681/9/10/11 military rated temperature wvdc type capacitance capacitance and voltage- designation 1 / in pf tolerance temperature limits avx style 1210/cdr33 (bp) cdr33bp102b--- 1,000 f,j,k bp 100 cdr33bp112b--- 1,100 f,j,k bp 100 cdr33bp122b--- 1,200 f,j,k bp 100 cdr33bp132b--- 1,300 f,j,k bp 100 cdr33bp152b--- 1,500 f,j,k bp 100 cdr33bp162b--- 1,600 f,j,k bp 100 cdr33bp182b--- 1,800 f,j,k bp 100 cdr33bp202b--- 2,000 f,j,k bp 100 cdr33bp222b--- 2,200 f,j,k bp 100 cdr33bp242a--- 2,400 f,j,k bp 50 cdr33bp272a--- 2,700 f,j,k bp 50 cdr33bp302a--- 3,000 f,j,k bp 50 cdr33bp332a--- 3,300 f,j,k bp 50 avx style 1210/cdr33 (bx) cdr33bx153b--- 15,000 k,m bx 100 cdr33bx183b--- 18,000 k,m bx 100 cdr33bx223b--- 22,000 k,m bx 100 cdr33bx273b--- 27,000 k,m bx 100 cdr33bx393a--- 39,000 k,m bx 50 cdr33bx473a--- 47,000 k,m bx 50 cdr33bx563a--- 56,000 k,m bx 50 cdr33bx683a--- 68,000 k,m bx 50 cdr33bx823a--- 82,000 k,m bx 50 cdr33bx104a--- 100,000 k,m bx 50 avx style 1812/cdr34 (bp) cdr34bp222b--- 2,200 f,j,k bp 100 cdr34bp242b--- 2,400 f,j,k bp 100 cdr34bp272b--- 2,700 f,j,k bp 100 cdr34bp302b--- 3,000 f,j,k bp 100 cdr34bp332b--- 3,300 f,j,k bp 100 cdr34bp362b--- 3,600 f,j,k bp 100 cdr34bp392b--- 3,900 f,j,k bp 100 cdr34bp432b--- 4,300 f,j,k bp 100 cdr34bp472b--- 4,700 f,j,k bp 100 cdr34bp512a--- 5,100 f,j,k bp 50 cdr34bp562a--- 5,600 f,j,k bp 50 cdr34bp622a--- 6,200 f,j,k bp 50 cdr34bp682a--- 6,800 f,j,k bp 50 cdr34bp752a--- 7,500 f,j,k bp 50 cdr34bp822a--- 8,200 f,j,k bp 50 cdr34bp912a--- 9,100 f,j,k bp 50 cdr34bp103a--- 10,000 f,j,k bp 50 military rated temperature wvdc type capacitance capacitance and voltage- designation 1 / in pf tolerance temperature limits avx style 1812/cdr34 (bx) cdr34bx273b--- 27,000 k,m bx 100 cdr34bx333b--- 33,000 k,m bx 100 cdr34bx393b--- 39,000 k,m bx 100 cdr34bx473b--- 47,000 k,m bx 100 cdr34bx563b--- 56,000 k,m bx 100 cdr34bx104a--- 100,000 k,m bx 50 cdr34bx124a--- 120,000 k,m bx 50 cdr34bx154a--- 150,000 k,m bx 50 cdr34bx184a--- 180,000 k,m bx 50 avx style 1825/cdr35 (bp) cdr35bp472b--- 4,700 f,j,k bp 100 cdr35bp512b--- 5,100 f,j,k bp 100 cdr35bp562b--- 5,600 f,j,k bp 100 cdr35bp622b--- 6,200 f,j,k bp 100 cdr35bp682b--- 6,800 f,j,k bp 100 cdr35bp752b--- 7,500 f,j,k bp 100 cdr35bp822b--- 8,200 f,j,k bp 100 cdr35bp912b--- 9,100 f,j,k bp 100 cdr35bp103b--- 10,000 f,j,k bp 100 cdr35bp113a--- 11,000 f,j,k bp 50 cdr35bp123a--- 12,000 f,j,k bp 50 cdr35bp133a--- 13,000 f,j,k bp 50 cdr35bp153a--- 15,000 f,j,k bp 50 cdr35bp163a--- 16,000 f,j,k bp 50 cdr35bp183a--- 18,000 f,j,k bp 50 cdr35bp203a--- 20,000 f,j,k bp 50 cdr35bp223a--- 22,000 f,j,k bp 50 avx style 1825/cdr35 (bx) cdr35bx563b--- 56,000 k,m bx 100 cdr35bx683b--- 68,000 k,m bx 100 cdr35bx823b--- 82,000 k,m bx 100 cdr35bx104b--- 100,000 k,m bx 100 cdr35bx124b--- 120,000 k,m bx 100 cdr35bx154b--- 150,000 k,m bx 100 cdr35bx184a--- 180,000 k,m bx 50 cdr35bx224a--- 220,000 k,m bx 50 cdr35bx274a--- 270,000 k,m bx 50 cdr35bx334a--- 330,000 k,m bx 50 cdr35bx394a--- 390,000 k,m bx 50 cdr35bx474a--- 470,000 k,m bx 50 1 / the complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level. add appropriate failure rate add appropriate termination finish capacitance tolerance add appropriate failure rate add appropriate termination finish capacitance tolerance
35 0805 size (l" x w") 5 voltage 50v =5 100v = 1 200v = 2 c dielectric 1b cg = a 2r1 = c 2f4 = g 103 capacitance code m capacitance tolerance see dielectrics c0g, x7r, y5v t specification cecc32101-801 t terminations t = plated ni and sn 2 marking packaging 2 = 7" reel paper/unmarked a special code a = std. product part number (example) range of approved components case dielectric voltage and capacitance range size type 50v 100v 200v 1bcg 0603 1b cg 0.47pf - 150pf 0.47pf - 120pf 0.47pf - 100pf 0805 1b cg 0.47pf - 560pf 0.47pf - 560pf 0.47pf - 330pf 1206 1b cg 0.47pf - 3.3nf 0.47pf - 3.3nf 0.47pf - 1.5nf 1210 1b cg 0.47pf - 4.7nf 0.47pf - 4.7nf 0.47pf - 2.7nf 1808 1b cg 0.47pf - 6.8nf 0.47pf - 6.8nf 0.47pf - 4.7nf 1812 1b cg 0.47pf - 15nf 0.47pf - 15nf 0.47pf - 10nf 2220 1b cg 0.47pf - 39nf 0.47pf - 39nf 0.47pf - 15nf 2r1 0603 2r1 10pf - 6.8nf 10pf - 6.8nf 10pf - 1.2nf 0805 2r1 10pf - 33nf 10pf - 18nf 10pf - 3.3nf 1206 2r1 10pf - 100nf 10pf - 68nf 10pf - 18nf 1210 2r1 10pf - 150nf 10pf - 100nf 10pf - 27nf 1808 2r1 10pf - 270nf 10pf - 180nf 10pf - 47nf 1812 2r1 10pf - 470nf 10pf - 330nf 10pf - 100nf 2220 2r1 10pf - 1.2? 10pf - 680nf 10pf - 220nf 2f4 0805 2f4 10pf - 100nf 1206 2f4 10pf - 330nf 1210 2f4 10pf - 470nf 1808 2f4 10pf - 560nf 1812 2f4 10pf - 1.8? 2220 2f4 10pf - 2.2? european detail specification cecc 32 101-801/chips standard european ceramic chip capacitors
36 packaging of chip components automatic insertion packaging tape & reel quantities all tape and reel specifications are in compliance with rs481. 8mm 12mm embossed or punched carrier 0805, 1005, 1206, 1210 embossed only 0504, 0907 1505, 1805, 1812, 1825 1808 2225 punched only 0402, 0603 qty. per reel/7" reel 2,000 or 4,000 (1) 3,000 1,000 qty. per reel/13" reel 10,000 10,000 4,000 (1) dependent on chip thickness. low profile chips shown on page 23 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per reel on 7" reels and are not available on 13" reels. for 3640 size chip contact factory for quantity per reel. reel dimensions tape a b* c d* n w 1 w 2 w 3 size (1) max. min. min. min. max. +1.0 7.9 min. 8mm 8.4 ?.0 14.4 (.311) (.331 +.060 ) (.567) 10.9 max. 330 1.5 13.0?.20 20.2 50 ?.0 (.429) (12.992) (.059) (.512?008) (.795) (1.969) +2.0 11.9 min. 12mm 12.4 ?.0 18.4 (.469) (.488 +.076 ) (.724) 15.4 max. ?.0 (.607) metric dimensions will govern. english measurements rounded and for reference only. (1)for tape sizes 16mm and 24mm (used with chip size 3640) consult eia rs-481 latest revision.
37 tape size b 1 d 1 fp 1 rt 2 wa 0 b 0 k 0 max. min. min. see note 6 see note 5 see note 2 8mm 4.55 1.0 3.5 0.05 4.0 0.10 25 2.5 max see note 1 (.179) (.039) (.138 .002) (.157 .004) (.984) (.098) 12mm 8.2 1.5 5.5 0.05 4.0 0.10 30 6.5 max. 12.0 .30 see note 1 (.323) (.059) (.217 .002) (.157 .004) (1.181) (.256) (.472 .012) 8mm 4.55 1.0 3.5 0.05 2.0 0.10 25 2.5 max. see note 1 1/2 pitch (.179) (.039) (.138 .002) 0.79 .004 (.984) (.098) 12mm 8.2 1.5 5.5 0.05 8.0 0.10 30 6.5 max. 12.0 .30 see note 1 double (.323) (.059) (.217 .002) (.315 .004) (1.181) (.256) (.472 .012) pitch embossed carrier configuration 8 & 12 mm tape only 8 & 12 mm embossed tape metric dimensions will govern constant dimensions tape size d 0 ep 0 p 2 t max. t 1 g 1 g 2 8mm 8.4 +0.10 1.75 0.10 4.0 0.10 2.0 0.05 0.600 0.10 0.75 0.75 -0.0 and (.059 +.004 ) (.069 .004) (.157 .004) (.079 .002) (.024) (.004) (.030) (.030) 12mm -0.0 max. min. min. see note 3 see note 4 variable dimensions notes: 1. a 0 , b 0 , and k 0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. the clearance between the end of the terminals or body of the component to the sides and depth of the cavity (a 0 , b 0 , and k 0 ) must be within 0.05 mm (.002) min. and 0.50 mm (.020) max. the clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (se e sketches c & d). 2. tape with components shall pass around radius ??without damage. the minimum trailer length (note 2 fig. 3) may require add itional length to provide r min. for 12 mm embossed tape for reels with hub diameters approaching n min. (table 4). 3. g 1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavi- ty whichever is less. 4. g 2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of t he carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. the embossment hole location shall be measured from the sprocket hole controlling the location of the emboss- ment. dimensions of embossment location and hole location shall be applied independent of each other. 6. b 1 dimension is a reference dimension for tape feeder clearance only. 8.0 +0.3 -0.1 (.315 +.012 ) -.004 8.0 +0.3 -0.1 (.315 +.012 ) -.004
38 punched carrier configuration 8 & 12 mm tape only 8 & 12 mm punched tape metric dimensions will govern constant dimensions tape size d 0 ep 0 p 2 t 1 g 1 g 2 r min. 8mm 1.5 +0.1 1.75 0.10 4.0 0.10 2.0 0.05 0.10 0.75 0.75 25 (.984) -0.0 and (.059 +.004 ) (.069 .004) (.157 .004) (.079 .002) (.004) (.030) (.030) see note 2 12mm -.000 max. min. min. variable dimensions tape size p 1 fwa 0 b 0 t 8mm 4.0 0.10 3.5 0.05 see note 1 see note 3 (.157 .004) (.138 .002) 12mm 4.0 .010 5.5 0.05 12.0 0.3 (.157 .004) (.217 .002) (.472 .012) 8mm 2.0 0.10 3.5 0.05 1/2 pitch (.079 .004) (.138 .002) 12mm 8.0 0.10 5.5 0.05 12.0 0.3 double (.315 .004) (.217 .002) (.472 .012) pitch notes: 1. a 0 , b 0 , and t are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body di mensions of the component. the clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (a 0 , b 0 , and t) must be within 0.05 mm (.002) min. and 0.50 mm (.020) max. the clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (se e sketches a & b). 2. tape with components shall pass around radius ??without damage. 3. 1.1 mm (.043) base tape and 1.6 mm (.063) max. for non-paper base compositions. 8.0 +0.3 -0.1 (.315 +.012 ) -.004 8.0 +0.3 -0.1 (.315 +.012 ) -.004 bar code labeling standard avx bar code labeling is available and follows latest version of eia-556-a.
39 bulk case packaging case quantities part size 0402 0603 0805 qty. 10,000 (t=0.6mm) (pcs / cassette) 80,000 15,000 5,000 (t? 3 0.6mm) benefits bulk feeder ?easier handling ?smaller packaging volume (1/20 of t/r packaging) ?easier inventory control ?flexibility ?recyclable case dimensions shutter slider attachment base 110mm 12mm 36mm case cassette gate shooter chips expanded drawing mounter head
40 surface mounting guide appendix 1: mlc capacitors physical properties the properties of mlc? are decided by their chemical composition and physical makeup. as manufacturers use slightly different compositions and designs this means that all mlc? do not have identical properties. most systems are, however, based on doped barium titanate raw materi- als and basically similar designs. there will be minor differ- ences in value for some of the physical constants quoted but these should not prove significant for practical purposes. temperature coefficient of expansion (cte) this varies according to which axis of the chip is being measured. across terminations (l) 11ppm/? across chip (w) 13ppm/? electrode (pd/ag) 16ppm/? it should be remembered that in attempting to match circuit board material with mlc? that the dynamic system should be considered (power on temperature rise) not the static system (uniform temperature rise). thermal conductivity ceramic 5w/m kelvin termination (ni bar) 380w/m kelvin electrode (pd/ag) 140w/m kelvin these figures show the problem of predicting the thermal behavior of mlc? each one being different according to its form and number of electrodes. substrate substrate capacitor capacitor maximum stress maximum stress solder fillet solder fillet thermal stress 1. thermal stress 2. t oper > t amb cte sub < cte cap t oper > t amb cte sub > cte cap ceramic cte 9.5 to 11.5 electrodes cte 18ppm /o c cte and conductivity of mlc materials. 140 w mk 4-5 w mk ppm /o c termination tin-lead and nickel over silver glass frit cte 18ppm /o c thermal conductivity 380 w mk table 1. coefficients of expansion and conductivity material cte (ppm/?) c (w/m kelvin) alumina 7 34.6 alloy 42 5.3 17.3 bati03 doped 9.5-11.5 4-5 copper 17.6 390 copper c 1 invar 6.7 filled epoxy 18-25 0.5 fr4/g10 18 nickel 15 86 polyimide/glass 12 polyimide/kevlar 7 silver 19.6 419 steel 15 46.7 tantalum 6.5 55 tin/lead 27 34
41 surface mounting guide appendix 1: mlc capacitors strength flexure 140 mpa fracture toughness 3gpa this merely confirms the well known high strength in com- pression, low strength in tension that ceramics normally have. chemical resistance ceramics themselves are very resistant to chemical attack, providing they are processed in a manner which prevents the incidence of cracks or chips in the body. in cases where cracks etc. are present, moisture can penetrate and cause insulation resistance to reduce. termination, whether silver/palladium or nickel barrier solder coated, can suffer chemical attack from pollutants in the air or packing materials. in order to preserve their solderability they should be kept in the packing the manufacturer sup- plied until required for use. points to watch are the use of paper and rubber bands, which contain sulphur com- pounds. handling ceramic chips can easily be damaged and contaminated by poor handling or storage. a chip or crack, contamination by hands or poor storage, use of metal tweezers (the surface or bare ceramic chips is very abrasive) can all induce subse- quent defect as described above. care must be taken to achieve the best results. termination types & applications the capacitor termination must be designed so that it has (a) a good electrical connection to the internal electrode sys- tem and (b) has good solderability and leaching properties with normally used fluxes, solders and soldering processes. surface mount assembly has permitted the use of a wider range of soldering processes than was traditionally viable for pin-through hole manufacture. this has, in turn, placed greater demands on the capacitor terminations, especially with regard to wave-soldering and some of the more prolonged reflow techniques. storage good solderability is maintained for at least twelve months, provided the components are stored in their ?s received packaging at less than 40? and 70% relative humidity. solderability terminations to be well tinned after immersion in a 60/40 tin/lead solder bath at 230 ?0? for 5 ? seconds. f f f f ceramic body an expanding rectangular annulus thermal stress on terminations. forces exerted by the termination exploded view of the termination and capacitor body showing forces exerted by the termination f f f f each electrode that enters the capacitor body acts like a wedge forcing the capacitor apart thermal stresses on electrodes/ceramic
42 surface mounting guide appendix 1: mlc capacitors component pad design component pads should be designed to achieve good sol- der filets and minimize component movement during reflow soldering. pad designs are given below for the most com- mon sizes of multilayer ceramic capacitors for both wave and reflow soldering. the basis of these designs is: ?pad width equal to component width. it is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. ?pad overlap 0.5mm beneath component. ?pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering. d1 d2 d3 d4 d5 case size d1 d2 d3 d4 d5 0402 1.70 (0.07) 0.60 (0.02) 0.50 (0.02) 0.60 (0.02) 0.50 (0.02) 0603 2.30 (0.09) 0.80 (0.03) 0.70 (0.03) 0.80 (0.03) 0.75 (0.03) 0805 3.00 (0.12) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.25 (0.05) 1206 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 1.60 (0.06) 1210 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 2.50 (0.10) 1808 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 2.00 (0.08) 1812 5.60 (0.22) 1.00 (0.04)) 3.60 (0.14) 1.00 (0.04) 3.00 (0.12) 1825 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 6.35 (0.25) 2220 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 5.00 (0.20) 2225 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 6.35 (0.25) dimensions in millimeters (inches) reflow soldering
43 surface mounting guide appendix 1: mlc capacitors wave soldering component spacing for wave soldering components, must be spaced sufficient- ly far apart to avoid bridging or shadowing (inability of solder to penetrate properly into small spaces). this is less impor- tant for reflow soldering but sufficient space must be allowed to enable rework should it be required. preheat & soldering the rate of preheat should not exceed 4 c/second to prevent thermal shock. a better maximum figure is about 2 c/second. for capacitors size 1206 and below, with a maximum thick- ness of 1.25mm, it is generally permissible to allow a tem- perature differential from preheat to soldering of 150?. in all other cases this differential should not exceed 100?. for further specific application or process advice please consult avx. cleaning care should be taken to ensure that the capacitors are thoroughly cleaned of flux residues especially the space beneath the capacitor. such residues may otherwise become conductive and effectively offer a low resistance bypass to the capacitor. ultrasonic cleaning is permissible, the recommended condi- tions being 8 watts/litre at 20-45 khz, with a process cycle of 2 minutes vapor rinse, 2 minutes immersion in the ultra- sonic solvent bath and finally 2 minutes vapor rinse. d1 d2 d3 d4 d5 case size d1 d2 d3 d4 d5 0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03) 0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05) 1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06) 1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10) 1808 6.60 (0.26) 1.50 (0.06) 3.60 (0.14) 1.50 (0.06) 2.00 (0.08) 1812 6.60 (0.26) 1.50 (0.06) 3.60 (0.14) 1.50 (0.06) 3.00 (0.12) 1825 6.60 (0.26) 1.50 (0.06) 3.60 (0.14) 1.50 (0.06) 6.35 (0.25) 2220 7.60 (0.29) 1.50 (0.06) 4.60 (0.18) 1.50 (0.06) 5.00 (0.20) 2225 7.60 (0.29) 1.50 (0.06) 4.60 (0.18) 1.50 (0.06) 6.35 (0.25) dimensions in millimeters (inches) 3 1mm (0.04) 3 1.5mm (0.06) 3 1mm (0.04)
44 internet/fax/cd rom/software need additional information on avx products internet for more information visit us on the worldwide web at http://www.avxcorp.com fax back service just dial 1-800-879-1613 and request the index for additional catalog information faxed to your fax number. cd rom or get in touch with your avx representative for a cd rom or copies of the catalogs and technical papers. software comprehensive capacitor application software library which includes: spicap (for mlc chip capacitors) spitan (for tantalum capacitors) spicalci (for power supply capacitors) spimic (for rf-microwave capacitors) for avx/elco connector information contact your local avx/elco representative notice: specifications are subject to change without notice. contact your nearest avx sales office for the latest specification s. all statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, wa rranty, or responsibility of any kind, expressed or implied. statements or suggestions concerning possible use of our products are made wi thout representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. the user should not assume that all safety measures are indicated or that other measures may not be required. specifications are typical and may not apply to all applications.
notice: specifications are subject to change without notice. contact your nearest avx sales office for the latest specification s. all statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee , warranty, or responsibility of any kind, expressed or implied. statements or suggestions concerning possible use of our product s are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. the user should not assume that all safety measures are indicated or that other measures may not be required. specifications are typical and may not apply to all applications.
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